We aim to quantitatively understand the fundamentals in friction, wear, adhesion, deformation, and material transfer between solid-solid contact via theory-driven models, experiments, and data analysis, enabling precision engineering and reliable interfaces.

We study chemical-mechanical polishing, brush cleaning, and hybrid bonding technologies for planarization and integration in semiconductors, displays, quantum devices, and more. We address surface damage, material heterogeneity, and integration complexity through pad design, interface engineering, and AI-based optimization.

We create functional surfaces and interfaces with novel materials using scalable, mechanism-informed strategies to improve manipulation, sensing, and electrochemical performance in emerging devices including soft electronics, energy systems, and micro/nano robotics.

We develop advanced and intelligent manufacturing platforms including multi-material additive manufacturing, process monitoring, and optimization using AI to enable autonomous, customizable, and reliable production of functional components across diverse applications.